Device Geometry
Represent electromagnetic response on semiconductor, dielectric, and photonic structure volume.
Integrated design platform
Planck Labs is building the end-to-end design platform for photonic, semiconductor, metasurface, and RF engineering — bringing geometry, meshing, multiphysics simulation, and design optimization into a single tool.
Method
Represent electromagnetic response on semiconductor, dielectric, and photonic structure volume.
Use integral operators for open-domain fields and scattering behavior.
Move geometry and material parameters through optimization loops.
Why Planck
Built for inhomogeneous, high-contrast, high-frequency problems that strain mainstream methods.
Error stays bounded per wavelength regardless of electrical size.
ε(r) and μ(r) optimize alongside shape.
Sharp material discontinuities. No staircase, no conformal meshing.
Runs on GPU.
Method comparison
| FDTD | FEM | Surface MoM | Planck | |
|---|---|---|---|---|
| Convergence order (3D) | p = 2 (Yee) | p = 2 default | p ≈ 1.5 (RWG) | p ≥ 6 (configurable) |
| DOF increase for 10× lower error | ≈ 32× | ≈ 32× | ≈ 100× (RWG) | ≤ 3× |
| Asymptotic compute (3D) | O(N^4/3) | O(N^3/2) | O(N log N) (MLFMM) | O(N log N) |
| Mesh empty space | Yes | Yes | No | No |
| Open-domain radiation | Needs PML | Needs PML | Analytical | Analytical |
| Inhomogeneous media | Yes | Yes | Hybrid only | Native |
| Sharp material jumps | Staircase | Mesh-conformal | n/a (surface) | Unaligned, true |
| High-frequency dispersion | Grows with size | Pollution effect | Pollution-free | (k₀h)^p, pollution-free |
| GPU acceleration | Yes | Yes (recent) | Limited | Yes |
Method-class characterizations reflect well-known mathematical properties of FDTD, FEM, and MoM under default solver settings. DOF cost shown for one-decade error reduction in 3D, where N scales as F^(3/p). Asymptotic compute scaling assumes appropriate acceleration techniques (MLFMM / FMM / FFT) and well-conditioned formulations with mesh-independent iteration counts. Per-vendor higher-order or specialized options exist but are rarely run in production. Specific products and capabilities cited as of 2026; capabilities of named products may evolve. Comparison shown for the underlying solver class, not for any specific commercial implementation.
Applications
Waveguides, bends, couplers, resonators.
Periodic media, phase masks, metalenses.
Packages, interconnects, high-frequency devices.
Geometry and material optimization across device parameters.
Workflow
01
Geometry
02
Materials
03
Solve
04
Optimize
Contact
Geometry, material stack, frequency or wavelength band, and target response are enough to start.